Nvidia and packaging partner Siliconware Precision Industries plan to multiply co-packaged optical engine production capacity by 15 times by mid-2027, followed by a 30-fold increase by the end of 2028. This expansion supports the launch of Nvidia’s Spectrum-6 co-packaged optics switches, which are designed for the company’s Vera Rubin AI infrastructure. The technology reduces power consumption and transmission distances by integrating optical engines directly alongside switching chips. Separately, Nvidia is investing $1.1 billion in US semiconductor testing capacity, while Amkor plans to increase interposer wafer production by more than 300% by the end of 2028.
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