Samsung Electronics has crossed the $1 billion sales mark for its next-generation AI memory chips, a milestone reached in roughly four months since mass production began in February 2026. HBM4 chips offer performance improvements exceeding 40% over previous standards and Samsung has secured a deal with AMD to power Instinct MI455X GPUs and EPYC processors, targeting bandwidths of up to 3.3TB/s. The company also began shipping samples of its 12-layer HBM4E in May 2026, an industry first, while discussions with NVIDIA are underway. Samsung is seeking to reclaim market share from SK Hynix, which has dominated this strategic segment of the memory industry.
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