Huawei, through its chip design arm HiSilicon and manufacturing partner SMIC, is targeting production of roughly 600,000 Ascend 910C AI accelerator chips in 2026, doubling previous output levels. The company is betting on novel architectures like Tau Scaling Law and LogicFolding to achieve transistor densities comparable to a 1.4nm process by 2031, without relying on restricted foreign lithography tools. DeepSeek has placed an order for at least 160,000 next-generation Ascend 950DT accelerators for a 1-gigawatt data center slated for late 2027 or early 2028. According to Bernstein, Huawei is expected to capture approximately 50% of China’s AI chip market by 2026, while Nvidia’s market share is predicted to collapse from 40% in 2025 to just 8% in 2026.
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