China’s largest DRAM maker, CXMT, plans to begin limited commercial HBM3E production within the next two months despite a yield of only 20% to 30%. That level, far below SK Hynix’s reported yield of around 70% on comparable products, means most of CXMT’s chips fail quality testing. Reuters also reports that the company’s manufacturing capabilities align more closely with the previous-generation HBM3 standard than with current HBM3E specifications. CXMT has already sent samples to Chinese customers, including Alibaba’s chip unit T-Head and AI chip designer Cambricon, for preliminary evaluation. The strategy comes amid an AI memory shortage in China caused by US export controls on HBM, and could give CXMT paying customers and real-world feedback as it works to improve its yields.
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