Nvidia and SPIL plan to expand optical engine capacity in Taiwan, covering components that convert electrical signals into light for data transfers between chips and switches. SPIL handles chip-scale packaging and testing, while TSMC fabricates silicon photonics through its COUPE platform. The expansion supports the scaling of Nvidia’s co-packaged optics Spectrum-X switches for AI data centers, with SN6800 configurations reaching throughput of up to 409.6 Tb/s. Nvidia says the technology delivers up to five times better power efficiency, uses four times fewer lasers and provides a mean time between failures ten times higher than traditional optical modules. For Taiwan, the move further strengthens the strategic role of advanced packaging and testing in the global AI hardware supply chain.
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