TSMC will supply its 3nm process technology for the base dies of Nvidia’s custom high-bandwidth memory chips called NVHBM. The three major memory makers, Samsung, SK Hynix, and Micron, have agreed to use this process, with Samsung reportedly working with TSMC on HBM base die manufacturing for the first time. NVHBM targets up to a 30% increase in memory bandwidth and 15% lower power consumption compared to the HBM4E standard. Micron expects volume production by 2027 and anticipates improved profitability from this arrangement. This shift reflects a broader trend where memory makers are outsourcing base die production to advanced logic foundries like TSMC.
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