TSMC is reportedly planning to raise prices for its CoWoS advanced packaging services by 10% to 20% from 2025 onward, after receiving approval from major customers including NVIDIA. Discussions about further increases in 2026 are also reportedly ongoing. TSMC’s monthly output is projected to reach 120,000 to 130,000 wafers by late 2026, while demand is expected to continue exceeding supply by 10% to 20%. To close part of the capacity gap, TSMC has signed a $2 billion, five-year agreement with GlobalFoundries, which will produce silicon interposers in Malta, New York, starting in 2028.
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