TSMC has reportedly begun planning the manufacture of 3D DRAM memory chips at Nvidia’s request, using a technology that stacks memory layers vertically. The company is still at an early stage, with no firm capital commitment or production timeline. The initiative, led by Hsu Kuo-chin, TSMC’s vice president of advanced packaging, could involve building new fabrication facilities or adapting existing sites. It comes amid a severe AI-driven memory shortage expected to affect supply and pricing well into 2028. In the third quarter of 2026, TSMC reported revenue of $46.72 billion and a gross margin of 66.4%, while high-performance computing accounted for 68% of sales.
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