Nordson launches ASYMTEK Vantage XL to meet surging semiconductor packaging demand

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Nordson Electronics Solutions unveiled the ASYMTEK Vantage XL, a precision fluid dispensing platform designed for panel-level packaging, at SEMICON Taiwan 2026. The system supports panels up to 510 by 515 millimeters, featuring thermal management, warpage mitigation, and multi-fiducial alignment capabilities. The company simultaneously reported fiscal Q3 2026 results that exceeded expectations, with adjusted EPS of $3.25, and raised its annual sales guidance to a range of $3.035 billion to $3.075 billion. In a collaboration with Powertech Technology, the firm achieved underfill yields exceeding 99% while cutting cycle times by roughly 30% through IntelliJet jetting technology.

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