The CEOs of Broadcom and Intel, Hock Tan and Lip-Bu Tan, said at a conference in Singapore that the rising cost of capital could become the main constraint on AI infrastructure expansion. According to them, financing difficulties could soon overtake the semiconductor and memory shortages that defined the last phase of the AI boom. Broadcom has already set up a 35 billion dollar financing platform with Apollo and Blackstone to support more than 20 gigawatts of planned AI capacity by 2028. Demand for computing infrastructure is projected to exceed supply until 2029 or 2030, while earlier constraints in wafers, memory and power have eased.
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