Diamond Foundry presented a 200 mm single-crystal diamond wafer on November 5 and 6, 2026, at the CarbonSemi 2026 conference in Ningbo, marking the first demonstration of its kind at that scale. Named D200mm, the crystal doubles the size of the 100 mm wafer announced in 2023 and could serve as a heat-dissipating substrate for chips. Its thermal conductivity of approximately 2,000 W/mK is five times that of copper, potentially improving cooling for AI processors and enabling smaller power electronics. The company is also developing a $2.77 billion large-scale production facility in Spain under the European Union’s semiconductor initiative. The displayed crystal remains unpolished, while production yields, defect density and compatibility with commercial manufacturing processes have not yet been disclosed.
Source: Read the original article
