South Korean memory giant SK Hynix broke ground on August 27 for its first US advanced packaging facility at Purdue University’s Research Park in West Lafayette, Indiana. The investment exceeds $4 billion for a 133.5-acre site, with mass production of HBM4E targeted for the second half of 2029. The facility is expected to create approximately 1,000 direct jobs and 7,000 indirect jobs across the broader supply chain. As the dominant HBM supplier for Nvidia, SK Hynix is establishing its first dedicated HBM packaging site outside South Korea. The project aligns with the US CHIPS Act, which incentivizes domestic semiconductor production to reduce reliance on Asian supply chains.
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