United Microelectronics Corporation approved an additional capital expenditure budget of approximately $3.2 billion on October 28, 2026, to accelerate facility expansions in Singapore and Tainan, Taiwan. The new capacity will focus on advanced packaging, silicon photonics, silicon capacitors and lithium niobate modulators, technologies designed for artificial intelligence infrastructure. Initial production is expected to begin in late 2028, with full capacity reached by 2030. In the third quarter of 2026, revenue increased 25.6% year over year to NT$74.24 billion and capacity utilization reached 92%, but the shares fell around 9% the following day because investors were concerned about the margin pressure created by the expansion.
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