TSMC’s quarterly demand for semiconductor manufacturing tools has climbed to roughly 1.9 times what was projected in December 2025, Deputy Co-COO Cliff Hou said at the Semicon Taiwan 2026 conference on September 2. The world’s largest chipmaker is currently constructing nearly 20 wafer fabrication plants simultaneously — 13 in Taiwan and 5 to 6 overseas — at a pace four to five times its normal rate, while facing persistent shortages of construction workers and equipment supply constraints. The company aims to produce 180,000 wafers per month on its advanced 3 nm process node by the end of 2026, with its 2026 CapEx guidance raised to a range of $60B to $64B, with 70% to 80% allocated to advanced production nodes. TSMC has committed an additional $100B toward its Arizona facilities, bringing its total American investment to $265B, and expects advanced-node supply to remain insufficient to meet AI-driven demand through at least 2028 to 2030.
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