TSMC has signed a seven-year agreement with Xintec to build and operate a line in Taiwan dedicated to the oS portion of its advanced CoWoS packaging technology, which combines logic chips and high-bandwidth memory on a silicon interposer. Xintec will provide the equipment and personnel, while TSMC will supply the building in the Central Taiwan Science Park, with mass production targeted for 2029. To finance the line, Xintec plans to raise NT$15 billion through convertible bonds. The partnership is part of TSMC’s broader capacity expansion, which also includes a $2 billion agreement with GlobalFoundries to produce interposers in the United States starting in 2028. The Xintec line is therefore not expected to ease near-term capacity constraints, while demand for AI chips remains stronger than supply.
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