Samsung Electronics has begun work on a new high-bandwidth memory HBM packaging facility at its Onyang campus in Asan, South Korea. The project includes five production lines and an investment of 46 trillion won, equivalent to approximately $34 billion. The site’s cleanroom space is expected to reach 31,000 square meters, while the campus’s total floor area will increase from 270,000 to 420,000 square meters. Operations are scheduled to begin in June 2028, one year earlier than previously announced, to address the persistent shortage of HBM for AI servers, which is expected to continue through 2028.
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