SK hynix, Solidigm and others pitch AI memory beyond HBM at OCP Global Summit

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SK hynix, Metrum AI, Solidigm and Nallasway presented several architectures designed to overcome high-bandwidth memory limitations at the 2026 OCP Global Summit in San Jose. SK hynix showcased its MARS system and 256 GB CXL 3.2 modules, claiming 80 GB/s bandwidth and a 30% improvement in energy efficiency. Metrum AI and Solidigm demonstrated a shared SSD pool for holding the KV cache, achieving up to 64.8 times faster time-to-first-token and 40.7 times higher throughput. Nallasway proposed a 3.2 TB memory expansion using LPDDR5X DRAM connected directly to AI processors. These demonstrations and proposals focused on disaggregated, tiered memory will still need to be validated through real-world deployments and supporting software.

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Telemac
Telemachttp://cryptoinfo.ch
Passionné de nouvelles technologies, j’explore l’univers de la blockchain et des cryptomonnaies pour partager l’actualité et les innovations du secteur.

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