AMD is ramping up production of its Helios AI systems featuring next-generation HBM4 memory. Each Helios rack packs 72 Instinct MI455X accelerators totaling 31,104 GB of HBM4. Mass production began in July 2026, with significant shipments expected in Q4 2026. Samsung, AMD’s preferred HBM4 supplier since a March 2026 agreement, has production capacity committed through 2029, posing the main constraint on AMD’s growth against Nvidia in the AI accelerator market.
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