Micron secured up to $6.44 billion in direct CHIPS Act funding in December 2024 and raised its total US capital expenditure commitment to over $250 billion through 2035. SK Hynix received $458 million in grants and up to $500 million in loans to build a $4 billion advanced high-bandwidth memory packaging facility in Indiana, with volume production expected in Q3 2029. SK Hynix currently dominates the HBM market with approximately 58% of global revenue as of Q1 2026, while Micron holds around 21%. These subsidies enable both chip giants to reduce the financial risk of building new fabs, which can cost upward of $10 billion each and take years to reach full production.
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