China’s semiconductor equipment imports climbed 9% year-over-year in July, according to a Barclays report, marking a sharp rebound from a 16% contraction in Q1. Back-end assembly equipment surged 35%, with wire bonders posting a remarkable 61% increase. Lithography equipment rose 7%, while chemical vapor deposition equipment surged 15%. Barclays projects wafer fabrication equipment imports to grow 10% in 2026 and 15% in 2027.
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