TSMC is reportedly in advanced talks to acquire two unused panel plants from AU Optronics for more than NT$30 billion, approximately $930 million. These facilities, located in the Central Taiwan Science Park, are adjacent to TSMC’s existing Fab 15 complex. TSMC intends to convert them into advanced packaging sites for artificial intelligence, specifically fan-out panel-level packaging and chip-on-panel-on-substrate technologies. This acquisition, nearly double the NT$17.14 billion paid for the Innolux plant in 2024, would significantly increase production capacity by using rectangular substrates instead of traditional circular wafers.
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