Intel is strengthening its position in advanced chip packaging with its EMIB technology, securing major clients including Google, Amazon, Tesla, SpaceX, and Cisco. Google has adopted EMIB-T packaging for its ninth-generation tensor processing unit codenamed « Humufish », representing a significant technical endorsement of Intel over TSMC. MediaTek announced on May 29, 2026 that it would support both TSMC CoWoS and Intel EMIB platforms, reflecting an industry-wide shift toward diversifying packaging suppliers. In response, TSMC began developing an « EMIB-like » technology as of July 30, 2026, while its CoWoS capacity remains constrained through 2025 despite expansion efforts. Intel’s EMIB and Foveros technologies are projected to generate billions in annual revenue, establishing the company as a strategic player in the AI semiconductor supply chain.
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