ASE Technology Holding, the world’s largest outsourced semiconductor assembly and test company, announced a $2 billion increase to its 2026 capital expenditure plans, bringing the total to approximately $10.5 billion. These funds will be split evenly between new facilities and equipment, with 13 greenfield sites and 8 expansions of existing locations to meet demand through 2028-2029. The LEAP advanced packaging division has already exceeded its $3.5 billion revenue target this year, with the goal of doubling that figure by 2027. In Q2 2026, ASE generated revenue of T$191.06 billion (approximately $5.88 billion), a 27% year-over-year increase, while net income jumped 180%.
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