Samsung Electronics signed a memorandum of understanding with Broadcom valued at over $200 billion, covering the supply of high-bandwidth memory (HBM4 and HBM4E) and manufacturing of AI chips using 2-nanometer processes. The agreement was signed on July 24 at an AI Summit in San Francisco and runs through 2030. Samsung will produce these components at its facility in Pyeongtaek, South Korea. This deal is part of a broader semiconductor and AI cooperation framework between South Korea and the United States, representing approximately $950 billion in joint investments.
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